All memory must have some sort of memory heat spreader.
This memory has the XTC Heatspreader
design.
XTC (Xtreme Thermal Convection) heatspreaders optimize the
thermal management of memory modules by promoting greater
airflow by means of micro-convection throughout what is
usually the dead air space inside conventional heatspreader
designs. In this manner, build-up of heat is avoided and
thermal dissipation of the memory components is offloaded
more efficiently through the honeycomb design. At the same
time, mechanical stability is maintained.
This honeycomb pattern is very clearly shown in the picture
below.
This design works a little better than the older design of
simply a thin sheet of copper or aluminum because there are
no more hot air pockets. As described above, this is a good
thing, but it doesn't mean you don't need direct active
cooling.
These heat spreaders do an excellent job of
keeping the modules cool and look amazing. Each module has
a cool looking NVIDIA SLI-ready sticker at the center and memory
information on a sticker at the left. When overclocking
please remember to have excellent case air circulation. I
would recommend actively cooling the memory with the
OCZ XTC Cooler. Having active cooling on the memory
means better overclocking results. Speaking of overclocking,
let's get to it...
