| #836 - OCZ DDR2 PC2-6400 Reaper Memory |
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| Written by Rodney Reynolds | ||||||||
| Tuesday, 19 June 2007 | ||||||||
Page 4 of 6 A closer look: All memory must have some sort of memory heat spreader, but this memory has a heatspreader, a heatpipe and a heatsink. The Reaper HPC has a unique cooling solution developed by OCZ to reduce heat very effectively as it's produced by the fast memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules. The diagram below best illustrates how the aluminum heatspeaker move heat away from the memory, into the heatpipe, then up to the optimized heatsink fin array.  
This design not only looks totally impressive, but it really works. The only disadvantage to this system is the vertical space needed. This may be a problem in some configurations where an oversized CPU cooler is used. 
 
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