All memory must have some sort of memory heat spreader, but
this memory has a heatspreader, a heatpipe and a heatsink. The Reaper HPC has a unique cooling solution developed by
OCZ to reduce heat very effectively as it's produced by the
fast memory. As heat rises into the thermo-conductive copper
heat pipe conduit, it is dissipated through the
strategically-placed compact aluminum fin array. By guiding
performance-robbing heat away from key memory components,
the unique Reaper HPC design helps facilitate improved
overclocking performance, while improving longevity and
stability of the modules.
The diagram below best illustrates how the aluminum
heatspeaker move heat away from the memory, into the
heatpipe, then up to the optimized heatsink fin array.
This design not
only looks totally impressive, but it really works. The only
disadvantage to this system is the vertical space needed.
This may be a problem in some configurations where an
oversized CPU cooler is used.
